The new microFLEX TM is a laser micromachining system for thin-film materials, handled with an integrated Roll-to-Roll transportation system.

With its high speed picture recognition system it is possible to make laser micromachining at a roll speed up to 2,8 m/s in real time.

Another proof of the flexibility of the microFLEX TM system is universal handling for every kind of material. The system is able to process plastic materials, thin-film layer substrates and to change the substrates in-between, even if the materials have different thicknesses.

The modular design of the new microFLEX TM system ensures high flexibility regarding different fields of component production for flexible electronics. Different treatment steps like cleaning and activation of foils, drying and assembling are available. In addition to the integration of laser processing, also printing and coating techniques, like engraving, Ink-Jet printing and Slot Die Coating can be offered.

The modules can be individually combined for R&D and entire production lines. Possible applications range from OPV production to printed batteries, printed transistors and RFID, to name only a few.

Features

• Online focus recalibration
• Integration of different laser sources depending on customers' demands
• Options like online QS system with high speed cameras

Static Parameters

• Material thickness: PET ≥ 50 μm; Paper ≥ 100 μm
• Internal roll diameter: 76 mm
• External roll diameter: max. 500 mm
• Roll width: up to 600 mm
• Roll weight: max. 100 kg

Dynamic Parameters

• Tractive force: 20 - 700 N
• Edge guide: ± 0,1 mm
• Velocity: max 170 m/min
• Velocity tolerance: ± 3 %
• Adjustable winding trait

Image and mark recognition

• Velocity with mark recognition: 20 - 60 m/min
• Incident and transmitted illumination: for transparent and opaque materials
• Camera resolution: 20 μm/Pixel; 5 μm/Pixel

During the manufacturing process of an OLED the different thin film layers need to be structured. Until recently mechanical or wet chemical technologies were used. A new and innovative solution for the structuring of these thin films is selective laser structuring.

3D-Micromac AG has developed and successfully introduced a state of the art machining concept for this laser structuring process on the market. Based on the microSTRUCTTM, a laser system was developed in the major application field of selective structuring of anode layers. In the process, the nearly transparent semiconductor tin-doped indium oxide (ITO) is used as anode material.

The integration of an ultra short pulsed laser in microSTRUCT OLEDTM guarantees a gentle structuring of the anode without any material damage to the substrate. A special highlight is the possibility to process substrates with variable and scalable sizes. This is realized by use of an innovative software controlled machining concept achieving a structuring speed of a few meters per second or more, depending on the selected laser source and the surface of the material.

In addition to that, further layers of an OLED can be machined with the same laser system. It is possible, for instance, to repair short-circuits and remove other defects in the layer system of the OLED.

Furthermore, the laser system can be used for engraving and marking at the surface of a glass substrates or inside. The almost athermal laser machining allows for a micro marking of glass without causing micro cracks in the substrate. A special feature of the laser workstation is an automatic handling system for reliable transportation of the OLED glass panels within the manufacturing process. An inspection system of the machined substrates - equipped with an automatic handling - can also be added.

System description (sample configuration):

• Max. Travel: X-axis: 600 mm, Y-axis: 400 mm
• Positioning accuracy: X-,Y-axis: ±1 μm, Z-axis: 10 μm / 50 mm
• Repeatability: X-,Y-,Z-axis: ±1 μm
• Laser power regulation in beampath and at the workpiece level possible
• Image recognition system for detection of the location and alignment of the workpiece (2-,4- or 6-point detection)
• Fully automatic adjustment of the workpiece
• Implementation of measurement tasks
• Free programmable CNC control system

Choice of Laser source (example):

• Type: picosecond laser, wave length: 355 nm, mean power: > 3,5 W @ 100kHz
• Repetition frequency: 0-2 MHz

Options (extract):

• 2nd beam path and scanner
• Automatic z-measurement
• Active exhaust system
• Fully automatic handling system for loading and unloading of workpieces

Due to the advancing miniaturization in electronics, semiconductor manufacturing and medical technology, it has become increasingly indispensable to possess the capability of machining smaller and finer structures into various substrates.

The microSTRUCT compactTM system is equipped with two working areas and perfectly suited for the processing of different kinds of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems.

The major advantages of the system are its maximal degree of freedom regarding the positioning of the substrate, its open system concept for the integration of different laser sources for sequential operation as well as its flexible, upgradeable control concept for a possible future integration of further components (e.g. additional axis systems and optical components).

Laser source (selectable, sample configuration):

• Integration of two laser sources and three beam paths for different wavelengths are possible
• Standard laser source: ns Laser 1064 nm with SHG and THG
• Further available laser types (ps, ns, fs, fiber-/disc laser), laser optics, scanner systems and fixed optics are integrable

System description (sample configuration):

• Direct-driven positioning system, XY-traverse path 600mm x 400mm
• Positioning accuracy ± 0,01 mm, Repeatability ± 0,005 mm
• Travel speed max. 150 mm/s, acceleration max. 100 mm/s²
• Positioning system is upgradeable with goniometers and lifting tables, integration of special positioning system on customers' demand
• Manual, semi-automatic or fully automatic workpiece alignment with XY-system and optical measurement system are available
• Adaption to different workpiece heights by using a separate Z positioning system
• 2 working areas for the use of scan systems, fixed optics or helical drilling optics
• Working area for every station: 300 mm x 300 mm
• On request one station can be used as measuring station
• The system is prepared for integration of an exhaust system for suction of ablated material
• Multilingual software based on English full worldwide remote access via network, customized log file to store all commands, processes and laser parameters; separate modes for operators, supervisors and service; programming in Visual Basic Script or via data import; interfaces GDS II, STL, DXF; addressing of up to 32 NC axes; intuitive graphical operator interface with preview, image recognition system, integrated energy monitor

Options:

• Fully automatic workpiece handling
• Integrated picture recognition system with up to four observation cameras
• Optical or tactile distance sensor
• Vacuum chuck or other chuck devices on request
• Quality control systems are available on customers' demand

Due to the advancing miniaturization in electronics, semiconductor manufacturing and medical technology, it has become increasingly indispensable to possess the capability of machining smaller and finer structures into various substrates.

The microSTRUCTvario system is equipped with three working areas and perfectly suited for the processing of different kinds of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin films.

The major advantages of the system are its maximal degree of freedom regarding the positioning of the substrate, its open system concept for the integration of different laser sources for sequential operation as well as its flexible, upgradeable control concept for a possible future integration of further components (e.g. additional axis systems and optical components).

Laser source (selectable, sample configuration):

• Integration of two laser sources and three beam paths for different wavelengths possible
• Laser sources, wavelengths, optics, scanners and fixed optics selectable
• Standard laser source: ps Laser 1064 nm with SHG and THG
• Further available ps-laser and other laser types (ns, fs, fiber-/ disc laser) integrable

System description (sample configuration):

• Direct-driven positioning system, XY-traverse path 1150 mm x 450 mm
• Positioning accuracy ± 0,002 mm, Repeatability ± 0,001 mm
• Travel speed max. 500 mm/s, acceleration max. 400 mm/s²
• Positioning system is upgradeable with goniometers and lifting tables, integration of special positioning system on customers' demand
• Manual, semi-automatic or fully automatic workpiece alignment with XY-system and optical measurement system available
• Adaption to different workpiece heights by using a separate Z positioning system
• 3 working areas for using scan systems, fixed optics or helical drilling optics
• Working area for every station: 450 mm x 450 mm
• On request one station can be used as measuring station
• The system is prepared for integration of an exhaust system for suction of ablated material
• Multilingual software based on English, full worldwide remote access via network; customized log file to store all commands, processes and laser parameters; separate modes for operators, supervisors and service, programming in Visual Basic Script or via data import; interfaces GDS II, STL, DXF; addressing of up to 32 NC axes, intuitive graphical operator interface with previewImage recognition system, integrated energy monitor

Laser source (selectable, sample configuration):

• Integration of two laser sources and three beam paths for different wavelengths possible
• Laser sources, wavelengths, optics, scanners and fixed optics selectable
• Standard laser source: ps Laser 1064 nm with SHG and THG
• Further available ps-laser and other laser types (ns, fs, fiber-/ disc laser) integrable

Options:

• Fully automatic workpiece handling
• Integrated picture recognition system with up to four observation cameras
• Optical or tactile distance sensor
• Vacuum chuck or other chuck devices on request
• Quality control systems are available on customers' demand